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Fracture Mechanics Evaluation of Cu/SiN Interface Adhesion Strength in the Multilayer Thin Film Structure of LSI Interconnects
https://nitech.repo.nii.ac.jp/records/5916
https://nitech.repo.nii.ac.jp/records/59161c0e7808-894f-489b-957d-822b17895544
名前 / ファイル | ライセンス | アクション |
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要旨_abstract_review (341.7 kB)
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要約_summary (150.9 kB)
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Item type | 学位論文 / Thesis or Dissertation(1) | |||||
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公開日 | 2016-12-06 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Fracture Mechanics Evaluation of Cu/SiN Interface Adhesion Strength in the Multilayer Thin Film Structure of LSI Interconnects | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_db06 | |||||
資源タイプ | doctoral thesis | |||||
その他(別言語等)のタイトル | ||||||
その他のタイトル | 集積回路内部多層薄膜配線構造におけるCu/SiN界面密着強度の破壊力学的評価 | |||||
言語 | ja | |||||
著者 |
Chen, Chuantong
× Chen, Chuantong |
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著者別名 | ||||||
姓名 | チン, テントウ | |||||
言語 | ja | |||||
学位名 | ||||||
言語 | ja | |||||
学位名 | 博士(工学) | |||||
学位名 | ||||||
言語 | en | |||||
学位名 | Doctor of Engineering | |||||
学位授与番号 | ||||||
学位授与番号 | 甲第1060号 | |||||
学位授与年月日 | ||||||
学位授与年月日 | 2016-09-07 | |||||
学位授与機関 | ||||||
学位授与機関識別子Scheme | kakenhi | |||||
学位授与機関識別子 | 13903 | |||||
言語 | ja | |||||
学位授与機関名 | 名古屋工業大学 | |||||
内容記述 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 主査:神谷 庄司 | |||||
言語 | ja |